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Reference Dimensions:
PulseGuard(R) Suppressors
2.24 +/- 0.18 (0.088" +/- 0.007")
1.04 (0.041") REF 0.36 (0.014")
1.66 +/- 0.06 (0.066" +/- 0.003")
Surface Mount Polymeric ESD Suppressors
0.15 +/- 0.08 (0.006" +/- 0.003")
1.91 (0.075") 1.09 (0.043")
3.00 +/- 0.20 (0.118" +/- 0.008") 0.69 +/- 0.10 (0.027" +/- 0.004)
PGB1 Series Lead-Free 0.84 +/- 0.05
(0.033" +/- 0.002") 0.91
(0.036") TYP 0.15 +/- 0.08 (0.006 +/- 0.003") TYP 0.81 (0.032") TYP
0.43 +/- 0.18 (0.017" +/- 0.007")
Description
Wave Solder
1.02 (0.040")
Reflow Solder
0.51 (0.020") 3.05 (0.120") 1.27 (0.050")
Reflow Solder Wave Solder
1.02 (0.040") 1.27 0.76 (0.030") (0.050") 1.02 (0.040") 1.02 3.30 (0.040") (0.130")
2.29 (0.090") 0.64 (0.025")
2.54 (0.100") 0.64 (0.025") 2.29 (0.090")
0.51 (0.020") 1.27 (0.050") 2.03 (0.080")
PulseGuard ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated 1.27 (0.050") circuitry and are best suited for low-voltage, high-speed 1.27 applications where low capacitance is important. Data ports (0.050") utilizing such high-speed protocols as USB 2.0, IEEE1394, HDMI and DVI can benefit from this new technology. PulseGuard suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 61000-4-2), while adding virtually no capacitance to the circuit. Features
0.76 (0.030")
0.76 (0.030")
Equivalent Circuits 0402 and 0603 Devices
Equivalent Circuit
SOT23 Device Circuit Equivalent
3
1
2
* RoHS compliant and lead-free * Ultra-low capacitance * Low leakage current * Fast response time * Bi-directional
* Withstands multiple ESD strikes * Compatible with pick-and-place processes * Available in 1000, 3000, 5000 and 10000 piece reels (EIA-RS481)
1
2
Applications * HDTV Hardware * Laptop/Desktop Computers * Network Hardware * Computer Peripherals * Digital Cameras * External Storage * Set-Top Boxes
Product Characteristics
Part Number PGB1010402 PGB1010603 PGB102ST23 Lines Protected 1 1 2 Component Package 0402 0603 SOT23
Electrical Characteristics
Specification ESD Capability: IEC 61000-4-2 Contact Discharge IEC 61000-4-2 Air Discharge Peak Voltage (typical) Clamping Voltage (typical) Rated Voltage (maximum) Capacitance (typical) Response Time Leakage Current (typical) ESD Pulse Withstand PGB1010402 8kV 15kV 1000V 250V 12VDC 0.04 pF <1nS <1nA (12 VDC) 100 pulses min PGB1010603 8kV 15kV 500V 150V 24VDC 0.06 pF <1nS <1nA (6 VDC) 1000 pulses min PGB102ST23 8kV 15kV 500V 150V 24VDC 0.12 pF <1nS <1nA (6 VDC) 1000 pulses min Some shifting in characteristics may occur when tested over multiple pulses at a very rapid rate Measured at 250 MHz Measured per IEC 61000-4-2 8kV Contact Discharge1 Measured per IEC 61000-4-2 8kV Contact Discharge1, at 25 nsec. Notes
Notes: 1 Testing performed on Littelfuse Test Set up as described in typical test setup section.
PGB1 Series Specifications are subject to change without notice. 1 Electronics Designers Guide
www.littelfuse.com (c)2007 Littelfuse
Capac
Vol
PGB1010603 PGB1010402
PulseGuard(R) Suppressors 200
10,000 0 -25 0 25
400
PGB102ST23 PGB1040805 PGB1010402
0.01 100
Surface Mount Polymeric ESD Suppressors
1,000 50 75
100
125
150
175
Frequency (MHz)
Time (ns)
Part Numbering System
Dimensions 0402 Device
Dimensions: mm (inch)
0.15 +/- 0.08 (0.006" +/- 0.003") 0.310 +/- 0.08 (0.012" +/- 0.003") 0.99 +/- 0.05 (0.039" +/- 0.002")
PGB1 01 0603 MR
70
** Note: 1,000 fF = 1 pF
Capacitance (fF)
LEAD-FREE PULSEGUARD(R) 1200 60 ESD SUPPRESSORS LINES PROTECTED: 1000 01 = 1 line 50 02 800 = 2 lines 04 = 4 lines
QUANTITY & PACKAGING CODE: MR = 1000 pieces WR = 3000 pieces NR = 5000 pieces KR = 10,000 pieces DEVICE SIZE CODE: 0402 = 0402 (1005) 0603 = 0603 (1608) ST23 = SOT23 PGB1010603
0.5 1.0
0.25 (0.010") 0.24 +/- 0.09 (0.009" +/- 0.004") 0.51 +/- 0.05 (0.020" +/- 0.002") Reflow Solder
102ST23 1040805 1010603 1010402
Voltage (V)
600 40 400
PGB102ST23 PGB1040805 1.5
2.0
200 Typical Device Capacitance 10,000 0 -25 1.00 0 25 50
Frequency (GHz) PGB1010402
Recommended for reflow soldering only
1.55 (0.061")
75
100
125
150
175 1200
0.56 (0.022")
0.38 (0.015") .58 (0.023")
Time (ns) Voltage (V)
Capacitance (pF)
0603 Device
800 0.10
PGB102ST23 PGB1010603 PGB1010402
1000 Reference Dimensions:
Dimensions: mm (inch)
0 fF = 1 pF
600 1.04
(0.041") REF
1.66 +/- 0.06 (0.066" +/- 0.003")
400
0.36 (0.014")
PGB1010603 0.15 +/- 0.08 PGB102ST23 (0.006" +/- 0.003")
200 0.01 100 1,000 10,000 0 0.43 +/- 0.18 (0.017" +/- 0.007") -25 0 25
Reflow Solder
0.51 (0.020") 3.05 (0.120")
0.84 PGB1010402 +/- 0.05
(0.033" +/- 0.002")
50
75
100
125
150
175
Frequency (MHz)
5 2.0
Time (ns) Wave Solder
Typical Device Capacitance
0.76 (0.030") Typical ESD Response 3.30 (0.130")
Typical ESD Response
1.00
1200 1000
1.27 (0.050")
1.27 (0.050") 0.76 (0.030")
Capacitance (pF) Voltage (V)
Voltage (V)
1200 1000
04000015NR
Note: For wave solder, increase the spacing in both the horizontal and vertical dimensions by 0.254 (.010") where denoted by an asterisk (*) 0.76 (0.030")
Reference Dimensions:
800
0.10 800 600 400 1,000 0 25 50 75
PGB1010603 PGB102ST23 PGB1010402
600 SOT23 Device
Dimensions: mm (inch) 400 Equivalent Circuit
GB102ST23 GB1010603 GB1010402
04000015NR 2.24 +/- 0.18
(0.088" +/- 0.007")
200 10,000 175 0 -25
1
3.00 +/- 0.20 (0.118" +/- 0.008")
2
1.91
0.01 200 100 0 -25
0
25
50
75 100 (0.075")
0.91 (0.036") TYP
125
150
1751.09
(0.043")
Frequency (MHz)
100 125 150
Typical Device Capacitance Typical ESD Response
0.69 +/- 0.10 (0.027" +/- 0.004) 0.81 (0.032") TYP
Time (ns)
10,000
Time (ns)
Typical ESD Response
0.15 +/- 0.08 (0.006 +/- 0.003") TYP
Reflow Solder
1.02 (0.040") 1.27 (0.050") 2.29 (0.090") 0.64 (0.025") 0.51 (0.020") 2.03 (0.080") 1.02 (0.040") 1.02 (0.040")
Wave Solder
1.02 (0.040") 1.27 (0.050") 2.54 (0.100") 0.64 (0.025") 2.29 (0.090") 1.27 (0.050")
1200 1000
Voltage (V)
800 600 400 200
04000015NR
2
4000015NR
PGB1 Series
www.littelfuse.com (c)2007 Littelfuse
Specifications are subject to change without notice.
Electronics Designers Guide
10,000
0 -25
0
25
50
75
100
125
150
175
PulseGuard(R) Suppressors
Surface Mount Polymeric ESD Suppressors
Physical Specifications
Materials Solderability Soldering Parameters Body: Glass Epoxy Terminations: Copper/Nickel/Tin MIL-STD-202, Method 208
Environmental Specifications
Operating Temperature -65C to +125C 0402 series: 40C, 95% RH, 1000 hours 0603, ST23: 85C, 85% RH, 1000 hours MIL-STD-202, Method 107, -65C to 125C, 30 min. cycle, 10 cycles MIL-STD-202, Method 201, (10 to 55 to 10 Hz, 1 min. cycle, 2 hrs each in X-Y-Z) MIL-STD-202, Method 215
Moisture Resistance Wave solder - 260C, 10 seconds maximum Reflow solder - 260C, 30 seconds maximum Thermal Shock
Design Consideration Because of the fast rise-time of the ESD transient, proper placement of PulseGuard suppressors are a key design consideration to achieving optimal ESD suppression. The devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard suppressors (connected from signal/data line to ground) directly behind the connector so that they are the first boardlevel circuit component encountered by the ESD transient.
Vibration
Chemical Resistance Solder Leach Resistance and Terminal Adhesion
IPC/EIA J-STD-002
Soldering Parameters
Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL)
Pb - Free assembly 150C 200C 60 - 180 seconds 3C/second max 3C/second max 217C 60 - 150 seconds 260C 10 - 30 seconds 6C/second max 8 minutes max Based on IPC/JEDEC J-STD-020
Peak Temperature (TP) Time within 5C of actual peak Temperature (tp) Ramp-down Rate Time 25C to peak Temperature (TP)
PGB1 Series Specifications are subject to change without notice.
3 Electronics Designers Guide
www.littelfuse.com (c)2007 Littelfuse
PulseGuard(R) Suppressors
Surface Mount Polymeric ESD Suppressors
Packaging
Part Number PGB1010402 PGB1010603 PGB102ST23 PGB1010603 Quantity & Packaging Code KR MR WR NR Quantity 10000 1000 3000 5000 Packaging Option Tape & Reel (7" reel) Tape & Reel (7" reel) Tape & Reel (7" reel) Tape & Reel (7" reel) Packaging Specification EIA RS-481-1 (IEC 286, part 3) EIA RS-481-1 (IEC 286, part 3) EIA RS-481-1 (IEC 286, part 3) EIA RS-481-1 (IEC 286, part 3)
Tape and Reel Specifications
Tt Dd
+ +
Ds
+ +
Description Ct - Cover tape thickness
Tw Ph
0402 Series (mm) 0.05 1.50 4.00 0.41 1.12 2.00 0.62 0.61 8.00
0603 Series SOT23 Series (mm) (mm) 0.05 1.50 4.00 0.58 1.85 4.00 1.02 0.65 8.00 0.06 1.50 4.00 1.02 3.23 4.00 2.46 1.77 8.00
Pd
+
+
+
+
Dd - Drive hole diameter Ds - Drive hole spacing Pd - Pocket depth Ph - Pocket height Ps - Pocket spacing Pw - Pocket width Tt - Carrier tape thickness Tw - Carrier tape width
Ct
Ps
Pw
Typical Test Setup
FARADAY CAGE
COMPUTER
AGILENT INFINIIUM 1.5 GHz 8 GS/s 30dB PASTERNAK ATTENUATOR PE7025-30 TEKTRONIX LOW CAP PROBE 6158 (20x TIP)
QUADTECH 1865 RESISTANCE METER
RESISTANCE TEST FIXTURE
ESD TEST FIXTURE TEST BOARD W/ DUT ESD PULSE GENERATOR
PGB1 Series Specifications are subject to change without notice.
4 Electronics Designers Guide
www.littelfuse.com (c)2007 Littelfuse

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